| 摘要 |
PURPOSE:To provide a method of manufacturing a photosetting interlayer insulating film which serves as an interlayer insulating film of a multilayer printed board and a multilayer printed board provided therewith. CONSTITUTION:A photosetting interlayer insulating film is formed of first composition composed of 20-80 parts by weight of epoxy resin whose softening point is lower than 100 deg.C and 80-20 parts by weight of phenolic resin and second composition composed of 10-50 parts by weight of thermoplastic resin and 0.1-5 parts by weight of cationic photoinitiator against 100 parts by weight of first composition. An inner circuit 6 is formed on a board 7 through etching, the surface of the circuit 6 is roughened, oxidized, and deoxidized, a photosetting interlayer insulating film 1 is laminated, bonded, and flattened by a thermocompression roll 8, cured by the irradiation of light 9, and an outer circuit is formed thereon through a conventional method, whereby a multilayer printed board is manufactured. By this setup, a multilayer printed board can be lessened in thickness and warpage at curing, so that components can be lessened in warpage and torsion. |
