| 摘要 |
<p>PURPOSE:To obtain a resin-sealed electronic component whose characteristic hardly drops even when it is used for many hours by a method wherein a resin- sealed body is formed in such a way that the following are covered with it: an intermediate adhesive layer formed so as to surround an electronic-element mounting region formed on a support plate; and an electronic element. CONSTITUTION:Parts excluding a semiconductor-chip mounting region on one main face of a support plate 2 are coated with an intermediate adhesive layer 9 composed of a polyimide-based resin. The intermediate adhesive layer 9 composed of the polyimide-based resin is laid between the support plate 2 and a resin-sealed body 16 so as to surround the semiconductor-chip mounting region. Since the intermediate adhesive layer 9 is brought firmly into close contact with both the support plate 2 and the resin-sealed body 16, the close contact power of the support plate 2 with the resign-sealed body 16 can be enhanced as compared with a case where the intermediate adhesive layer 9 does not exist. As a result, it is possible to prevent that a foreign body such as moisture or the like reaches the semiconductor-chip mounting region. Thereby, it is possible to obtain a semiconductor device whose characteristic is not dropped for a long time.</p> |
