CERAMIC MULTILAYER SUBSTRATE

摘要

PURPOSE:To provide a ceramic multilayer substrate wherein stable wire bonding operation can be expected when a bare semiconductor element is mounted regarding a ceramic multilayer substrate which is used for various electronic devices. CONSTITUTION:A die bond pad 4 is in contact with a rear of a semiconductor element 6 to be mounted and is formed in a front of a ceramic multilayer substrate 1 to fix an electric potential of the rear. A via conductor 2a which is electrically connected to the die bond pad 4 is arranged in a part of the die bond pad 4 which is not in contact with the rear of the semiconductor element 6 to be mounted to eliminate influence of a projection part generated in the die bond pad 4 by difference of coefficient of sintering contraction between a ceramic substrate material (green sheet) and the via conductor.