发明名称 |
High density grid array socket |
摘要 |
A leadless component socket comprises a one- or two-piece leadless component contact socket assembly having a plurality of holes with a respective plurality of spring contacts disposed therein. The socket assembly includes a finger slot or slots to facilitate the manual removal of a chip carrier from the socket and a bias clip and integral keyed corner for assuring proper alignment of the chip carrier with the contacts of the socket assembly. The socket further comprises a cover, a cover support, an insulator assembly and a backup plate or other fastening means for supporting the socket on a printed circuit board. The socket assembly can be configured with a variety of contact terminal ends adapted for a desired mode of circuit board interface. A variety of cover configurations are also accommodated and disclosed.
|
申请公布号 |
US5215472(A) |
申请公布日期 |
1993.06.01 |
申请号 |
US19910748505 |
申请日期 |
1991.08.22 |
申请人 |
AUGAT INC. |
发明人 |
DELPRETE, STEPHEN D.;SANTOS, DON;CORBESERO, STEVEN R. |
分类号 |
G01R1/04;H01R13/24;H05K7/10 |
主分类号 |
G01R1/04 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|