| 摘要 |
PURPOSE:To provide a thin, hermetic semiconductor package with reduced high-frequency losses and capable of containing a plurality of semiconductor chips such as photodiodes and semiconductor laser elements. CONSTITUTION:A semiconductor chip 6 is attached to a flat metal block 1 having a slot 1b. A stripline circuit board 21 formed of ceramic or dielectric having a stripe pattern on it is inserted into the slot and hermetically fixed. The metal block 1 and the board 21 cross at right angles. The board 21 has a wire bonding face at the front end of the stripe pattern 12, and the bonding face is perpendicular to the direction of signal transmission of the stripline. |
