| 摘要 |
PURPOSE:To provide a method of manufacturing a multilayer printed wiring board whose insulating base material is formed of thermoplastic resin is provided with a conductive paste wiring pattern that contains through-hole connections, where through-hole connections can be easily enhanced in reliability. CONSTITUTION:A process is provided, where a breathing type support 2 is provided onto the surface of a vacuum suction type stage 1, if necessary, and a thermoplastic resin film 4 used for the formation of a required wiring pattern which contains through-hole connections is disposed on a thermoplastic resin film 3 where a through-hole 3a is selectively bored. Furthermore, a process where a required wiring pattern of conductive paste 5 is formed on the surface of the wiring pattern forming thermoplastic resin film 4 sucked by vacuum and another process where a thermoplastic resin film 4' on which a wiring pattern is formed is aligned, laminated on the film 3, and formed into one piece through thermocompression are provided. |
