| 摘要 |
<p>PURPOSE:To enable a multilayered wiring board to be enhanced in dimensional stability without carrying out an annealing process. CONSTITUTION:A base material is impregnated with thermosetting resin and dried out for the formation of a prepreg 3, and the prepreg 3 is primarily formed into an inner material 2 by thermocompression. The prepreg 3 is laid on the surface of the inner material 2, which is secondarily formed into a multilayered laminate board by thermocompression. At this point, the glass transition temperature of resin contained in the inner material is set higher than the temperature of thermocompression carried out at a secondary formation process by 15 deg.C.</p> |
