发明名称 SEMICONDUCTOR MANUFACTURING DEVICE
摘要 <p>PURPOSE:To fix different-sized wafers without changing a wafer presser ring so as to match a wafer size by turning said wafer presser ring to a length- variable arm. CONSTITUTION:A wafer 2 is mounted on a stage 4 which is dent-shaped toward its central part and the wafer 2 is pressed and fixed with an arm which changes the length from above. More specifically, to fix a 6 inch wafer, an arm 5 is arranged to change the length proper to press the 6 inch wafer where the outer peripheral part of the wafer is vertically pressed with the stage 4 and the arm 5. On the other hand, when it is necessary to fix a 5 inch wafer, the arm 5 is arranged to change its length proper to press the 5 inch wafer. At that time, since the arm 5 is slanted to align with the dent of the stage 4, this construction prevents the arm 5 from coming into contact with the stage 4 even if the arm 5 extends its length and presses the outer periphery of the wafer 2 vertically with the stage 4 and the arm 5.</p>
申请公布号 JPH05136252(A) 申请公布日期 1993.06.01
申请号 JP19910293325 申请日期 1991.11.08
申请人 SEIKO EPSON CORP 发明人 KOKUBU TAKASHI
分类号 H01L21/66;H01L21/68;H01L21/683 主分类号 H01L21/66
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