| 摘要 |
<p>PURPOSE:To provide a heating element cooling device which efficiently cools and boils a heating element which highly heats a semiconductor device or the like. CONSTITUTION:The part of low-temperature cooling medium liquid 11 which cools a semiconductor device 2 is split from a second nozzle 6, the liquid 11 is mixed by injection with the flow of vapor/liquid two phase high-temperature cooling medium 12, which cools the semiconductor device 2 by the jet from a first nozzle 5 and flows out, and the vapor phase is eliminated. The heating element cooling device is provided with such mixing mechanism. Therefore, the boiling bubbles are prevented from covering the semiconductor device 2 positioned in the downstream of the cooling medium liquid flow and deteriorating the cooling function. The unstableness caused by the intermittent cooling medium liquid flow by the retention of the partial boiling bubbles in high- temperature cooling medium discharging wiring 7 is eliminated and the heating element such as the semiconductor device 2 which generates high-heating value that generates remarkable quantity of boiling bubbles is always stably cooled.</p> |
