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发明名称
SEMICONDUCTOR PACKAGE PROVIDED WITH HEAT SINK
摘要
申请公布号
JPH05136301(A)
申请公布日期
1993.06.01
申请号
JP19910293341
申请日期
1991.11.08
申请人
NEC CORP
发明人
HOJO SAKAE
分类号
H01L23/36;H01L23/467
主分类号
H01L23/36
代理机构
代理人
主权项
地址
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