| 摘要 |
PROBLEM TO BE SOLVED: To provide a flux for a rapid heating method and solder paste for the rapid heating method, used for the rapid heating method such as a laser flow capable of scattering of a solder alloy.SOLUTION: The flux for a rapid heating method includes rosin, a glycol ether-based solvent, organic acid, and a thixotropic agent, the solvent is a glycol ether-based low boiling point solvent having boiling point set to 200°C or lower, and the content of the low boiling point solvent is set to 20 w% or more to 40 w% or less, and the solder paste for the rapid heating method is prepared by mixing this flux with solder alloy powders. When a high boiling point solvent having a boiling point exceeding 200°C is further included, the content of the low boiling point solvent in the entire solvent is set to 60 w% or more.SELECTED DRAWING: None |
