发明名称 |
SiGe and Si FinFET structures and methods for making the same |
摘要 |
FinFET structures and methods for making the same. A method includes: creating a plurality of Silicon fins on a first region of a substrate, creating a plurality of Silicon-Germanium fins on a second region of the substrate, adjusting a Silicon fin pitch of the plurality of Silicon fins to a predetermined value, and adjusting a Silicon-Germanium fin pitch of the plurality of Silicon-Germanium fins to a predetermined value, where the creating steps are performed in a manner that Silicon material and Silicon-Germanium material used in making the plurality of fins will be on the semiconductor structure at a same time. |
申请公布号 |
US9391077(B2) |
申请公布日期 |
2016.07.12 |
申请号 |
US201414176575 |
申请日期 |
2014.02.10 |
申请人 |
International Business Machines Corporation |
发明人 |
Cheng Kangguo;Doris Bruce B.;Hashemi Pouya;Khakifirooz Ali;Reznicek Alexander |
分类号 |
H01L21/02;H01L27/092;H01L29/16;H01L29/161;H01L21/8238 |
主分类号 |
H01L21/02 |
代理机构 |
|
代理人 |
Kelly L. Jeffrey;Meyers Steven |
主权项 |
1. A method for forming a semiconductor structure comprising:
creating a plurality of Silicon fins on a first region of a substrate; creating a plurality of Silicon-Germanium fins on a second region of the substrate; adjusting a Silicon fin pitch of the plurality of Silicon fins to a predetermined value; and adjusting a Silicon-Germanium fin pitch of the plurality of Silicon-Germanium fins to a predetermined value, wherein the Silicon-Germanium fins are tall and have a high Germanium concentration wherein one of the i)Silicon fin pitch and the ii) Silicon-Germanium fin pitch is adjusted to be different from the other, wherein creating a plurality of Silicon-Germanium fin step comprises:
providing a plurality of Silicon fins on the second region of the substrate;creating spaces between the plurality of second region Silicon fins;filing the spaces between the plurality of second region Silicon fins with Silicon-Germanium; andremoving the plurality of second region Silicon fins; wherein the adjusting a Silicon fin pitch step comprises:
creating spaces between the plurality of first region Silicon fins;filing the spaces between the plurality of first region Silicon fins with Silicon-Germanium;masking both i)at least one of the plurality of first region Silicon fins and ii) the Silicon-Germanium material between the at least one masked first region Silicon fin and another unmasked first region Silicon fin; andremoving the at least one unmasked first region Silicon fin. |
地址 |
Armonk NY US |