| 摘要 |
<p>PURPOSE:To provide a method of mounting by which soldering to a chip-type electronic component can be facilitated. CONSTITUTION:A method of mounting an electronic component (a chip capacitor) 5 on a board (an epoxy resin or ceramic board) 2 comprises a process for applying a polyimide resin 3 on the board 2, a process in which the polyimide resin film 3 on the board is patterned to make a place to be mounted with the component 5 expose, a process for applying creamy solder 4 on the exposed place, a process for placing the component 5 on the place coated with the creamy solder 4 and a process for heating the board to 250 deg.C or thereabouts.</p> |
