| 摘要 |
<p>PURPOSE:To reduce the thickness of a display device by the thickness of a glass epoxy substrate or a paper phenol substrate and an IC by packaging the IC for drive or for input/output on the transparent substrate of an input device. CONSTITUTION:Transparent substrates 1 and driving circuits 2 and 3 are connected with chip-on-glass for directly connecting an IC chip on glass. Namely, the connection is made by using an anisotropic conductive film (ACF) to a pad formed so as to connect the electrodes of the transparent substrates 1 with the IC chip in face-down. The connection with input cables 4 and 5 for supplying signal to the driving circuits 2 and 3 is made by the ACF. These driving circuits are composed of shift registers. Thus, since the driving circuits 2 and 3 are provided on the two transparent substrates 1, it is not necessary to mount the glass epoxy or paper phenol substrate mounting the driving circuits for the input device on the down side of a liquid crystal display device 6, and the display device can be made thin by the thickness of the substrate in comparison with the conventional display device.</p> |
