| 摘要 |
<p>2123877 9310573 PCTABS00022 An electronic device (10) is made by a method of connecting a circuit member (18) to a substrate (12). The circuit member has a discontinuous passivating layer (20) with recesses therein establishing electrical contacts. The member is connected to a mounting surface (14) of a substrate having conductive paths (16). An adhesive (26) including a resin with spaced conductive metal particles suspended therein is applied over the conductive paths. The distance between electrical contacts (22) and the conductive paths is decreased to provide electrical conduction through the adhesive, while maintaining the adhesive between conductive paths non-conductive. The conductive paths may have established thereon raised or protruding contact surfaces (24) over a portion thereof. The member is mounted on the adhesive while vertically aligning the contacts over preselected protruding contact surfaces. Pressure is applied to concentrate the conductive metal particles between the contacts and conductive paths allowing conduction therethrough.</p> |
