发明名称 COOLING APPARATUS FOR ELECTRONIC AND COMPUTER COMPONENTS
摘要 <p>Apparatus for cooling components or subassemblies of equipment at one or more locations comprises one or more first and one or more second reactors, remote from said equipment, each reactor containing a complex compound of a polar refrigerant and a metal salt a first heater in said first reactor and a second heater in said second reactor for heating the complex compound therein, respectively, a condenser, remote from said equipment, for converting gaseous refrigerant to a liquid phase, and means for cooling said condenser with ambient air, one or more evaporators, each in heat exchange communication with one or more of said components or subassemblies within said equipment, valve means cooperating with first conduit means for alternately directing polar refrigerant from said first and said second reactors, respectively, to said condenser, and second conduit means for directing ammonia from said condenser to said one or more evaporators and third conduit means for directing ammonia from said one or more evaporators to said first and said second reactors. Alternatively, the apparatus comprises a first reactor located at a remote location from said equipment, and a second reactor located in heat exchange communication with a component or subassembly of said equipment, each of said first or second reactors containing a different complex compound of a polar refrigerant and a metal salt, wherein the equilibrium temperature of the complex compound in said first reactor differs from the equilibrium temperature of the complex compound in said second reactor by between about 10 °C and about 150 °C at the same operating pressure, heating means for heating a complex compound in said first reactor, and conduit means for directing polar refrigerant between said reactors.</p>
申请公布号 WO1993010654(A1) 申请公布日期 1993.05.27
申请号 US1992007492 申请日期 1992.09.04
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