| 摘要 |
2123610 9310202 PCTABS00022 Described are reagent systems for the surface-bonding and/or coating, in particular the heat-seal coating, of substrates, the systems comprising an aqueous dispersion of an epoxide-curable resin (I) and an aqueous dispersion of epoxy compounds (II) as accelerators. The use, as the curable resin (Ia), of polyurethane polymers containing functional groups which are reactive towards epoxides enables heat-seal-coated substrates to be produced which retain their integrity and are suitable for use in the manufacture of flexible printed circuits, for instance.
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