发明名称 |
COMPOSITION FOR FORMING BASE COATING IN ELECTROLESS PLATING |
摘要 |
PROBLEM TO BE SOLVED: To provide a composition for forming a base coating in electroless plating capable of forming an electroless plating coating having high adhesion on a non-conductor substrate by an inexpensive and simple operation having a small load on an environment.SOLUTION: There is provided a composition for forming a base coating in electroless plating containing a polysilsesquioxane compound and metal nanoparticles. In the composition for forming the base coating in electroless plating, the polysilsesquioxane compound has in molecules, an organic group having reducibility of metal ion, and an organic group having inhibition ability of aggregation of metal atoms.SELECTED DRAWING: Figure 1 |
申请公布号 |
JP2016141837(A) |
申请公布日期 |
2016.08.08 |
申请号 |
JP20150018294 |
申请日期 |
2015.02.02 |
申请人 |
OKUNO CHEM IND CO LTD;OSAKA MUNICIPA TECHNICAL RESEARCH INSTITUTE |
发明人 |
TESHIMA SAYURI;TAKEMURA YASUTAKA;MURAHASHI KOICHIRO;OTSUKA AKIKUNI;MITAMURA KOJI;WATASE SEIJI;MATSUKAWA KOYO |
分类号 |
C23C18/18;H05K3/18;H05K3/38 |
主分类号 |
C23C18/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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