发明名称 COMPOSITION FOR FORMING BASE COATING IN ELECTROLESS PLATING
摘要 PROBLEM TO BE SOLVED: To provide a composition for forming a base coating in electroless plating capable of forming an electroless plating coating having high adhesion on a non-conductor substrate by an inexpensive and simple operation having a small load on an environment.SOLUTION: There is provided a composition for forming a base coating in electroless plating containing a polysilsesquioxane compound and metal nanoparticles. In the composition for forming the base coating in electroless plating, the polysilsesquioxane compound has in molecules, an organic group having reducibility of metal ion, and an organic group having inhibition ability of aggregation of metal atoms.SELECTED DRAWING: Figure 1
申请公布号 JP2016141837(A) 申请公布日期 2016.08.08
申请号 JP20150018294 申请日期 2015.02.02
申请人 OKUNO CHEM IND CO LTD;OSAKA MUNICIPA TECHNICAL RESEARCH INSTITUTE 发明人 TESHIMA SAYURI;TAKEMURA YASUTAKA;MURAHASHI KOICHIRO;OTSUKA AKIKUNI;MITAMURA KOJI;WATASE SEIJI;MATSUKAWA KOYO
分类号 C23C18/18;H05K3/18;H05K3/38 主分类号 C23C18/18
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