摘要 |
<p>According to the present invention, there is provided a method of making a polyimide multilayer interconnection board having multiple line layers using a polyimide resin for interlayer insulation on a ceramic substrate or a hard organic substrate, in which, in order to electrically connect one block comprising a laminate having a plurality of line layers to another block of the same arrangement, a metallic bump provided at each block is utilized. At least one of the pair of metallic bumps, which is connected to each other, comprises a solder. With the two subassemblies forced against each other, the metallic bump made of the solder is heated up to a temperature enough to melt so that the contacting metallic bumps are connected. In consequence, a through hole adapted to electrically connect the plurality of blocks becomes unnecessary with the result that the production process is simplified and the time required for it is shortened. <IMAGE></p> |