发明名称 Polyimide multilayer interconnection board and method of making the same.
摘要 <p>According to the present invention, there is provided a method of making a polyimide multilayer interconnection board having multiple line layers using a polyimide resin for interlayer insulation on a ceramic substrate or a hard organic substrate, in which, in order to electrically connect one block comprising a laminate having a plurality of line layers to another block of the same arrangement, a metallic bump provided at each block is utilized. At least one of the pair of metallic bumps, which is connected to each other, comprises a solder. With the two subassemblies forced against each other, the metallic bump made of the solder is heated up to a temperature enough to melt so that the contacting metallic bumps are connected. In consequence, a through hole adapted to electrically connect the plurality of blocks becomes unnecessary with the result that the production process is simplified and the time required for it is shortened. <IMAGE></p>
申请公布号 EP0543331(A2) 申请公布日期 1993.05.26
申请号 EP19920119617 申请日期 1992.11.17
申请人 NEC CORPORATION 发明人 KIMBARA, KOHJI
分类号 H01L23/538;H05K3/00;H05K3/28;H05K3/32;H05K3/40;H05K3/46;(IPC1-7):H05K3/46 主分类号 H01L23/538
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