| 发明名称 |
CONDUCTIVE ADHESIVE USEFUL FOR BONDING A SEMICONDUCTOR DIE TO A CONDUCTIVE SUPPORT BASE |
| 摘要 |
<p>A conductive die attach composition containing no solvent and substantially no ionic impurities which comprises: (a) an epoxy resin system comprising (i) at least one low viscosity epoxy resin; and (ii) at least one epoxy resin hardener; (b) at least one unsaturated monomer which, when polymerized, is not capable of reacting with said epoxy resin system; (c) at least one free radical initiator for polymericing said unsaturated monomer; and (d) finely divided silver particles.</p> |
| 申请公布号 |
EP0502992(A4) |
申请公布日期 |
1993.05.26 |
| 申请号 |
EP19910901230 |
申请日期 |
1990.11.28 |
| 申请人 |
ADVANCED PRODUCTS, INC. |
发明人 |
CHEN, ANDREW;FRENTZEL, RICHARD, L. |
| 分类号 |
C09J163/00;C08F283/10;C08F292/00;C08G59/00;C08G59/40;C08K3/08;C08L63/00;C09J151/08;C09J151/10;H01B1/22;H01L21/52;(IPC1-7):H01B1/02;C08K5/00;C09J5/02;B32B27/38;B32B3/00 |
主分类号 |
C09J163/00 |
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