| 发明名称 |
CERAMIC SUBSTRATE HAVING WIRING INCORPORATING SILVER |
| 摘要 |
A ceramic substrate comprises a ceramic body and a wiring pattern made of a silver series selectively formed on the major face of the ceramic body. The ceramic body contains silver particles of 0.1 to 2.5 percent by weight of the body. <IMAGE> |
| 申请公布号 |
EP0470839(A3) |
申请公布日期 |
1993.05.26 |
| 申请号 |
EP19910307283 |
申请日期 |
1991.08.08 |
| 申请人 |
NEC CORPORATION |
发明人 |
KATA, KEIICHIRO;SHIMADA, YUZO |
| 分类号 |
H05K3/46;H01L23/15;H01L23/538;H05K1/00;H05K1/03;H05K1/09;(IPC1-7):H05K3/46 |
主分类号 |
H05K3/46 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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