| 发明名称 |
Method for manufacturing polyimide multilayer wiring substrate. |
| 摘要 |
<p>A layered structure comprising wiring layers and polyimide layers is formed on a ceramics board and a layered structure comprising wiring layers and polyimide layers is formed on an aluminum board. Both the structures are bonded together through adhesives to bring metal bumps formed on the former structure into electric contact with metal bumps formed on the surface of the latter structure and thereafter the aluminum board is removed. <IMAGE></p> |
| 申请公布号 |
EP0543364(A2) |
申请公布日期 |
1993.05.26 |
| 申请号 |
EP19920119708 |
申请日期 |
1992.11.19 |
| 申请人 |
NEC CORPORATION |
发明人 |
HASEGAWA, SHINICHI;YOKOKAWA, SAKAE |
| 分类号 |
H01L21/48;H01L23/538;H05K3/00;H05K3/28;H05K3/32;H05K3/40;H05K3/46 |
主分类号 |
H01L21/48 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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