Water-soluble solder flux.

摘要

The composition of the present invention includes a water-soluble soldering flux requiring no thermal energy to place the water-soluble flux in an active state. The water-soluble soldering flux contains from about 1 percent to about 5 percent by weight, based on the weight of the water-soluble soldering flux, of an inorganic acid which, in solution, forms anions of the acid having a low propensity for forming metal complexes; from about 30 percent to about 70 percent by weight, based on the total weight of the water-soluble soldering flux, of an anionic surfactant; and from about 30 percent to about 70 percent by weight, based on the total weight of the water-soluble soldering flux, of a diluent. The composition of the present invention may contain a fourth component, a viscosity modifier from about 5 percent to about 40 percent by weight, based on total weight of the water-soluble soldering flux.