SUBSTRATE FOR POWER MODULE AND POWER MODULE

摘要

PROBLEM TO BE SOLVED: To provide a substrate for a power module which enables improvement of adhesion between a circuit layer of the substrate for the power module which is sealed by a mold resin and the mold resin, maintains good bondability of a semiconductor element, and achieves high reliability for a long time, and to provide a power module using the substrate for the power module.SOLUTION: A substrate 70 for a power module includes: a circuit layer 10 laminated on one surface of a ceramic substrate 20 and a heat radiation layer 30 laminated on the other surface. A porous metal layer 40 is laminated on a part of a surface of the circuit layer 10.SELECTED DRAWING: Figure 1