Multi-point probe assembly for testing electronic device

摘要

A test probe assembly including a plurality of electrically conductive probe arms each of which is secured to a substrate and electrically coupled to one of electrically conductive lines provided on the substrate. An intermediate portion of the arm is arranged to be resiliently deformable when a probe point which extends therefrom comes into contact with a terminal of the electronic device under test. A guide is provided on the structure on which the arms are mounted, for guiding the probe point so that movement other than reciprocation is either prevented or arrested. The resilient portion is arranged with respect to the probe point so that generation of motion other than reciprocation of the probe point is attenuated.