发明名称 Microwave oven package
摘要 A laminate structure useful for incorporating into a package structure for the microwave cooking of foodstuffs for consumption comprises an outer layer polymeric material, an outer layer of microwave transparent material, a grid layer having an electroconductive surface surrounding transmissive apertures located between the outer layers, and a thin layer of electroconductive material of sufficient thickness so that a portion of incident microwave energy is converted to thermal energy also located between the outer layers. The structure is useful in providing controlled surface heating and microwave transmittance to achieve a more uniformly heated product employing
申请公布号 US5213902(A) 申请公布日期 1993.05.25
申请号 US19910656736 申请日期 1991.02.19
申请人 BECKETT INDUSTRIES INC. 发明人 BECKETT, D. GREGORY
分类号 B32B3/10;B32B15/08;B65D81/34 主分类号 B32B3/10
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