| 摘要 |
PURPOSE:To omit the wiring length substantially, prevent noise from being mixed in, and reduce a wiring area by projecting two leads of an IC from a casing, using one lead as a substrate connecting pin, and using the other lead as a connector pin when the IC is housed in the casing formed of a resinous molding. CONSTITUTION:A connector 1 is constituted of a package IC 2 having a pair of leads 2a and 2b and a casing 3 to cover the IC 2 formed so as to project these leads 2a and 2b. Here, the IC 2 is an element in which an input and an output of a buffer driver transistor array and so on are made symmetrical with each other. As for the sealing-up of the IC2 in a resinous molding 3, one lead 2a is bent downward by 90 degrees, and the other lead 2b is extended in the horizontal direction along a guide part 3a of the molding 3. In this way, the lead 2a is used for substrate connection, and the lead 2b is used for a connector, respectively. |
