Multilayer printed circuit and associated multilayer material

摘要

A multilayer printed circuit, including: first and second layers, each comprising dielectric material, at least one of these layers having an opening therethrough for which the other layer does not have a corresponding opening therethrough, at least one of the layers bearing a conductive path; there being disposed between and bonded to these layers a third layer comprising substantially chemically nonpermeable material to chemically isolate the conductive path against subsequent treatment of the printed circuit; all three layers having corresponding datums formed thereon located for relative mutual alignment of the corresponding features on the layers.