发明名称 |
Process for plating a metallic deposit between functional pattern lines on a substrate |
摘要 |
Disclosed is a process for plating a metallic deposit between functional pattern lines on a substrate, comprising (a) forming a cured film containing a catalyst for electroless plating on the substrate, (b) forming functional pattern lines on said cured film, and (c) conducting electroless plating.
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申请公布号 |
US5213850(A) |
申请公布日期 |
1993.05.25 |
申请号 |
US19910759756 |
申请日期 |
1991.09.12 |
申请人 |
NIPPON PAINT CO., LTD. |
发明人 |
MATSUMURA, AKIRA;OHATA, MASASHI;ISHIKAWA, KATSUKIYO |
分类号 |
C23C18/16;H05K3/18 |
主分类号 |
C23C18/16 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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