LEAD FRAME FOR SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF

摘要

PURPOSE:To remarkably enhance a wire bonding property wherein a conductor pattern to be used as a joining electrode part formed in order to achieve multi- pin design of a lead-frame main body is formed easily and a semiconductor integrated circuit is made electrically conductive to the lead frame. CONSTITUTION:When a lead frame for semiconductor device use is manufactured, an insulating layer 3 is formed at least in the peripheral end part on an island 1 and a conductor pattern 4 to be used as a joining electrode part is then formed in the peripheral end part in the insulating layer 3 on the island 1 by using a printing method using a conductor paste so as to face an inner lead. It is preferable that the surface of the conductor pattern is flattened and that the pattern its made thin. In addition, it is preferable that an electroless- plated layer or an electrolytically plated layer is formed on the pattern.