摘要 |
A method and apparatus of controlling a shot peening apparatus are disclosed in which the shot peening apparatus has an enclosure in which a workpiece and a peening nozzle are located. The peening nozzle is movable between a working position and a measuring position and, when in its working position, is located a distance D from the workpiece. The shot peening apparatus may be numerically controlled in order to move the peening nozzle relative to the workpiece, or vice versa, and to move the peening nozzle between its working and measuring positions. A laser velocimeter device is utilized to establish a measurement point within the shot peening closure. At preselected points during the operational cycle of the shot peening apparatus, the nozzle is moved from its working position to a measuring position such that it is separated from the measurement point a distance D equal to the distance between the nozzle and the workpiece when in its working position. In its measuring position, the peening nozzle is operated in the same manner as in its working position such that the shot elements pass through the measurement point.
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