发明名称 PRINTED WIRING BOARD
摘要 PURPOSE:To provide a printed wiring board which is safe in public health, excellent in wire bonding characteristics, and cheap. CONSTITUTION:The outermost surface of a mounting terminal part 721 of a conductor circuit 72 of a printed wiring board is coated with a palladium plating film 1. The palladium plating film 1 is formed through an electroless plating method, where cyanogen compound is not contained in plating liquid. A palladium plating film 1 is comparatively cheaper than a gold plating film and formed without causing an adverse effect to public health.
申请公布号 JPH05129761(A) 申请公布日期 1993.05.25
申请号 JP19910313325 申请日期 1991.10.31
申请人 IBIDEN CO LTD 发明人 OKUDA YASUHIRO
分类号 H01L21/60;H05K3/24 主分类号 H01L21/60
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