| 摘要 |
PURPOSE:To enhance the adhesive properties between a bonding ball at the tip of a wire and a pad under a state in which the deformation of the bonding ball is minimum in terms of a bonding process which connects the pad on a semiconductor device to the wire. CONSTITUTION:A contact bonding load produced, when a bonding ball comes into contact with a pad, is adapted to be smaller than the contact bonding load produced when supersonic waves are forced to act on after the contact bonding. The contact bonding load is set to a low load when the ultrasonic waves are oscillated. Then, impact is inflicted upon between the pad and the ball in the oscillation direction of the ultrasonic waves and in the vertical direction when or slightly before the ultrasonic waves are forced to act on. |
