发明名称 WIRE BONDER
摘要 PURPOSE:To obtain the title wire bonder capable of increasing the manufacturing yield in the wire bonding step by a method wherein the title bonder is provided with respectively specific spool revolving unit, a spool shifting unit, a revolution detecting circuit and a shifting unit drive control circuit. CONSTITUTION:A wire 2 continuously wound up around the surface of a spool 1 in columnar shape along the axial direction is fed to a bonding tool 10 through a back tension unit 5. The title wire bonder is provided with a spool revolving unit 11 controlling the revolution of the spool 1 as well as a spool shifting unit 12 shifting the spool 1 and spool revolving unit 11 in the axial directions A2, A1 of the spool 1, furthermore, a revolution detecting circuit 13 detecting the revolution of the spool 1 as well as a shifting unit drive control circuit 14 shifting the spool shifting circuit 12 by specific shifting amount per specific revolution at the detection signal from the revolution detecting circuit 13.
申请公布号 JPH05129360(A) 申请公布日期 1993.05.25
申请号 JP19910287631 申请日期 1991.11.01
申请人 HITACHI LTD;HITACHI TOKYO ELECTRON CO LTD 发明人 ONODERA ATSUSHI;ODAGIRI MASAO
分类号 H01L21/60;B65H49/34;B65H54/28;B65H59/38 主分类号 H01L21/60
代理机构 代理人
主权项
地址
您可能感兴趣的专利