| 摘要 |
PURPOSE:To fix correctly a flip-chip component, which is provided with connection terminal parts on its bottom, on connection lands on a ceramic substrate in a high-density surface packaging by a method wherein projected bumps are formed on the connection terminal parts on the flip-chip component and the component is connected to the connection lands on the ceramic substrate in such a way that the point parts of the bumps are inserted into through holes. CONSTITUTION:Projected bumps 3 are formed on connection terminal parts 2 by a wire bonder. Through holes 6, in which the point parts of the bumps 3 are fitted in the centers of connection lands 5 formed in such a way as to weld to the terminal parts 2 under the bottom of a flip-chip component 1, are provided in a ceramic substrate 4, such as a hybrid IC. A solder paste 7 is printed and applied on the lands 5 on the substrate 4 using a printed mask, the point parts of the bumps 3 are made to insert into the holes 6 provided in the lands 5 as guides to place the component 1 on the lands and the component 1 is reflowed and is welded to the connection lands 5 on the ceramic substrate.
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