| 摘要 |
PURPOSE:To provide an improved lead frame wherein it hardly absorbs humidity until the mounting operation of an SMD after the manufacture of the SMD, it is not stripped due to a shearing force generated at the bonding interface inside a package in a heating operation and, as a result, a package crack is not caused. CONSTITUTION:A second metal layer 4a whose etch rate is slow as compared with that of a first metal layer 1a for a lead-frame main body is formed on a face opposite to the semiconductor chip mounting face of the lead frame; inverted-pot-shaped dimples 5a which pass the second metal layer 4a and which have been etched up to the inside of the first metal layer 1a for the lead-frame main body are provided. Since the dimples have an inverted-pot-shaped structure, a resin the inside of the dimples is bonded firmly to the lead frame. As a result, the bonding interface between the resin and the lead frame is sufficiently strong against a shearing force and the lead frame is not stripped. Consequently, it is possible to obtain an effect that the generation of a package crack is improved. |
