| 摘要 |
<p>PURPOSE:To realize collection and supply of semiconductor wafers with high efficiency, by collecting at the same time two semiconductor wafers after working with two hand parts, making collection and supply operation be finished during cutting operation of semiconductor wafers, and making the hand parts of a collection mechanism and a supply mechanism await in the vicinity of blade center of a cutting mechanism. CONSTITUTION:After a cutting mechanism 3 has finished cutting operation, a holding mechanism retracts on the blade rotation center shaft of the cutting mechanism 3, expands a sub-holding board, and relieses the moving route of the respective hand parts 57 of a collection mechanism 5 and a supply mechanism 2. Thereby the collection mechanism 5 and the supply mechanism 2 can be prevented from coming into contact with a blade 32 of the cutting mechanism 3. The moving route is formed in the vertical plane containing a main holding board and the sub-holding board of the holding mechanism, and a wafer W can be retained on the vertical plane. Semiconductor wafers Wa, Wb wherein working is finished are collected at the same time with the two hand parts 57, and collection and supply are finished during cutting operation of semiconductor wafers. The collection mechanism 5 and the hand parts 57 are made to await in positions in the vicinity of the center of the blade 32.</p> |
