| 摘要 |
PURPOSE: To make thin a semiconductor package by jointing a semiconductor chip to the upper and lower sides of an inner lead by soldering. CONSTITUTION: Pads 13' and 13 that are formed in two rows, so as to cross each other, are formed on upper and lower side semiconductor chips 11' and 11, and solders 14 and 14' are formed on the pads 13' and 13. Then, an inner lead 15 of a lead frame is joined to the upper and lower side semiconductor chips 11' and 11 by the solders 14' and 14, respectively, thus improving the integration of elements and making a lamination-type semiconductor package thin. |
