| 摘要 |
PURPOSE:To simplify the title bonding device by making the bonding part coating removable without providing any specific coating removing means. CONSTITUTION:During the lead side bonding step after finishing the semiconductor element 2 side bonding step, after a coated metallic fine wire 1 comes into contact with a bonding surface (c), a capillary 4 in the specified loaded state is shifted in the horizontal direction (arrow direction) to break down the coating (d) and then the final bonding step is performed (e). |
