| 摘要 |
PURPOSE:To provide a method of surely mounting an electronic component provided with a lead on a mounting object. CONSTITUTION:A suction nozzle 48 sucks a square resin film 20 which joins the roots of leads 16 of an electronic component provided with a holding sheet with a square suction protrusion 124 by vacuum. The resin film 20 is pressed against the flat end face of the suction protrusion 124 to be corrected in bend, and a part of the lead 16 fixed to a printed board 18 is positioned on the same plane and brought into contact with the printed board. Moreover, a suction body 54 is energized toward the printed board 18 by a spring 100, the resin film 20 is pressed against the end face of the suction protrusion 124, firmly sucked, and accurately corrected in bend, and all the leads 16 are pressed down against the printed board 18 and surely brought into contact with the printed wiring board 18. |
