| 摘要 |
PURPOSE:To provide an excellent heat dissipating efficiency by mounting a heat dissipating trunk on an inner surface of a package and connecting the trunk to a heat generating element of an IC body via a metal wire, thereby forming a new heat dissipating passage. CONSTITUTION:Heat dissipating trunks 27, 29 are mounted on an inner surface of a package 26 for containing a hybrid IC body 21. That is, both ends of heat conductive metal wires 31 are bonded to the trunks 27, 29 made of thermal conductive materials and heat generating elements 23-25 of the body 21 on the inner surface of the package 26. Accordingly, a heat transfer passage of the elements 23-25, the wires 31, the trunks 27, 29 and the package 26 is formed. Further, the wires 31 and the trunks 27, 29 are formed of heat conductive materials. Thus, heats generated from the elements 23-25 are efficiently transferred to the package 26, and dissipated from the package 26. |
