发明名称 Light-emitting device and method for manufacturing the same
摘要 A highly reliable light-emitting device and a manufacturing method thereof are provided. A light-emitting element and a terminal electrode are formed over an element formation substrate; a first substrate having an opening is formed over the light-emitting element and the terminal electrode with a bonding layer provided therebetween; an embedded layer is formed in the opening; a transfer substrate is formed over the first substrate and the embedded layer; the element formation substrate is separated; a second substrate is formed under the light-emitting element and the terminal electrode; and the transfer substrate and the embedded layer are removed. In addition, an anisotropic conductive connection layer is formed in the opening, and an electrode is formed over the anisotropic conductive connection layer. The terminal electrode and the electrode are electrically connected to each other through the anisotropic conductive connection layer.
申请公布号 US9444020(B2) 申请公布日期 2016.09.13
申请号 US201514943330 申请日期 2015.11.17
申请人 Semiconductor Energy Laboratory Co., Ltd. 发明人 Chida Akihiro
分类号 H01L21/00;H01L33/62;H01L33/48;H01L51/00;H01L51/52;H01L51/56;H01L27/12;H01L27/32;H01L33/20;H01L33/00 主分类号 H01L21/00
代理机构 Robinson Intellectual Property Law Office 代理人 Robinson Intellectual Property Law Office ;Robinson Eric J.
主权项 1. A method for manufacturing a light-emitting device comprising a terminal electrode and a first electrode, the method comprising the steps of: forming an EL layer over the first electrode, wherein a first layer comprising an organic compound contained in the EL layer is formed over the terminal electrode when the EL layer is formed; forming a second electrode over the EL layer; forming a first substrate having a first opening over the second electrode with a bonding layer interposed therebetween, wherein the terminal electrode, the first layer, and the first opening are overlapped with each other; and exposing the terminal electrode by removing the first layer with an organic solvent.
地址 Kanagawa-ken JP