| 摘要 |
PURPOSE:To provide the title adhesive excellent in heat resistance, hot melt bonding workability and bond strength, useful for e.g. metals, comprising a specific polyimide and electrically conductive filler at specified proportion. CONSTITUTION:The objective adhesive comprising (I) a polyimide with >=80mol% thereof imidated, prepared by reaction between (1) an amine component consisting of (A) a mol of 1,3-bis(3-aminophenoxy)benzene, (B) b mol of a siliconediamine of the formula R1 and R2 are each divalent 1-5C aliphatic group, etc.; R3 and R4 are each monovalent aliphatic group, etc.; n is 1l100) and (C) c mol of another diamine component (e.g. 3,3'-dimethyl-4,4'- diaminobiphenyl) and (D) d mol of an acid dianhydride component (e.g. pyromellitic dianhydride) with either component A or B being the essential component at the molar ratios: (a+b)/(a+b+c+d)=0.3-0.55 and (a+b+c)/d=0.8-1.3 and (II) 50-900wt.%, based on the polyimide, of an electrically conductive filler <=50mum in mean particle diameter such as of gold or copper. |
