| 摘要 |
PURPOSE:To produce a heat-resistant resin molding excellent in abrasion resistance and adhesion by applying an organic solvent to the surface of a resin molding containing a (meth)acrylimide structure, drying it, subsequently applying an ultraviolet-curing composition thereto and irradiating with ultraviolet rays. CONSTITUTION:(A) An organic solvent (preferably acetic acid, ethyl acetate, chloromethane, etc.) is applied to the surface of a resin molding composed of a polymer or a copolymer containing <=98wt.% monomer units (preferably methyl methacrylate unit) selected from (meth)acrylic acid and esters thereof and >=2wt.%, preferably >=10wt.% (meth)acrylimide units of the formula (R1 to R3 are H or 1-20C alkyl, aryl, aralkyl, alkaryl group or mixture thereof and H or methyl is preferable) and dried. (B) An ultraviolet-curing composition [preferably having two or more (meth)acryloyloxy group in one molecule] is then, after blending a photosensitizer and a diluent as necessary, applied and ultraviolet rays are subsequently applied to cure the composition. |
