| 摘要 |
In a semiconductor chip carrier which has a rectangular insulating substrate (2) having four corners (2a,2b,2c,2d) and electrode leads deposited on a peripheral surface of the substrate and which is mounted onto a circuit board with each electrode lead being connected to the corresponding board electrode through a solder mass, widths of the electrode leads (32b) care wider at each of the four corners than those of the electrode leads (32a) located at positions except the four corners. An area of the contact through the solder between each electrode lead positioned at each corner and the corresponding board electrode is wider than that between each of the other electrode lead and each corresponding board electrode. As each electrode lead positioned at each corner is strongly connected to the board electrode, it is seldom peeled off from the board electrode even when the circuit board is twisted or warped during or after the process of mounting the chip carrier onto the circuit board. <IMAGE> |
