| 摘要 |
A semiconductor package (20) includes a flagless leadframe having leads and a frame (12), and a semiconductor chip (24) having an upper surface (24a) and a lower surface (24b), wherein a portion of the lower surface (24b) is attached to the frame (12), and the upper surface (24a) and any exposed portion of the lower surface (24b) are substantially freed of carbon and carbon compounds. Residual carbon and carbon compounds are removed from the upper surface (24a) and the exposed portion of the lower surface (24b) by hydrogen flame or UV/ozone cleaning. A mold compound (22) encapsulates the semiconductor chip (24) and the leadframe except for leads which extend from the package (20). <IMAGE>
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