发明名称 |
AN ADDITIVE PROCESS FOR FINE-PITCH MULTILAYER VIAS |
摘要 |
The process of the present invention allows inter- connecting one conductive layer to another in a Multichip Module. The process uses bumps formed by wire bonding, or any other means of forming bumps of .002"-.004" height with comparable diameter. These bumps create an opening through dielectric insulating layers, thereby allowing one conductive layer to be electrically connected to the next conductive layer. |
申请公布号 |
CA2077720(A1) |
申请公布日期 |
1993.05.19 |
申请号 |
CA19922077720 |
申请日期 |
1992.09.08 |
申请人 |
AG COMMUNICATION SYSTEMS CORPORATION |
发明人 |
MCCOY, DIRK D.;JOHANSEN, SCOTT W. |
分类号 |
H01L21/607;H01L23/522;H05K1/00;H05K1/09;H05K3/40;H05K3/46;(IPC1-7):H05K3/12 |
主分类号 |
H01L21/607 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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