发明名称 |
PROCESSO DE LIGACAO ADESIVA DE UMA PRIMEIRA E UMA SEGUNDA SUPERFICIES DE PAPELAO,E,PRODUTO FORMADO DE PAPELAO |
摘要 |
<p>A method for adhesively bonding opposed paperboard surfaces to each other to form a strengthened bond in a paperboard product and paperboard products formed thereof, comprising the steps of (A) applying a green-strength adhesive to at least a portion of the first paperboard surface; (B) applying a styrene-butadiene latex adhesive or a modified styrene-butadiene latex adhesive as a strengthening adhesive to at least a portion of either the first or the second paperboard surface such that the green-strength adhesive is substantially offset from the strengthening adhesive when the first and second paperboard surfaces are positioned in an opposed relationship; (C) orienting the first and second paperboard surfaces such that they are opposed to each other; (D) contacting the first and second surfaces together to form the strengthened bond and (F) sufficiently immobilizing the strengthened bond for a suitable period of time to allow the strengthened bond to set. In addition, there is provided a method for adhesively bonding opposed paperboard surfaces to form a strengthened bond in a paperboard product, and paperboard products formed thereof, by applying a strengthening adhesive consisting essentially of a styrene-butadiene latex adhesive or a modified styrene-butadiene latex adhesive to at least a portion of the first paperboard surface, contacting together the paperboard surfaces to form the strengthened bond and sufficiently immobilizing the strengthened bond for a suitable period of time to allow the strengthened bond to set. Both virgin and recycled paperboard can be used.</p> |
申请公布号 |
BR9204395(A) |
申请公布日期 |
1993.05.18 |
申请号 |
BR19929204395 |
申请日期 |
1992.11.12 |
申请人 |
THE MEAD CORPORATION |
发明人 |
R. KENNETH WATKINS;JAMES W. WRIGHT;WILLIAM J. CULHANE |
分类号 |
B29C65/48;B29L7/00;B29L9/00;B31B1/62;B32B7/12;B32B29/00;C08J5/12;D21H27/32;(IPC1-7):D21J1/08 |
主分类号 |
B29C65/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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