| 摘要 |
PURPOSE:To eliminate connection defective by shaping a through-hole for connecting an interlaminar wiring pattern at an accurate position even if a wiring pattern layer of a circuit substrate is deviated and thermo-compression bonded. CONSTITUTION:Circuit substrates 1a to 1d wherein a wiring pattern layer is formed are hot contact bonded, spot facings 6a to 6c are processed to expose a reference pattern 5 of wiring pattern layers 2b to 2d from a surface, spot facings 6a to 6c are processed to expose a reference pattern 5 of wiring pattern layers 2b to 2d to be connected by through-holes 4a, 4b from a surface, an X-Y coordinate value of the reference pattern 5 of the wiring pattern layers 2b to 2d to be connected by the through-holes 4a, 4b is measured, mutual deviation amount is calculated, any of the reference patterns 5 is corrected by the deviation amount and the through-holes 4a, 4b are shaped based on the corrected reference patter 5. |
