METHOD AND APPARATUS FOR SOLDERING SURFACE-MOUNTABLE COMPONENTS TO A PRINTED CIRCUIT BOARD

摘要

A method and apparatus for soldering surface-mountable components to a printed circuit board includes a soldering head have a suction pipette located in the center of a thermode with a rectangularly arranged set of soldering stirrups. The thermode and suction pipette are individually vertically moveable relative to one another for precise positioning of a surface-mountable component at a predetermined position on a printed circuit board. Soldering at a predetermined solder location with positional correctness is accomplished in a single work cycle.